公开(公告)号：US20250104897A1

公开(公告)日：2025-03-27

申请号：US18813360

申请日：2024-08-23

Applicant: TDK Corporation

Inventor： Tsubasa OZAWA ,  Yohei TADAKI ,  Takuya NIIBORI ,  Asuka ISHII ,  Yuya OSHIMA ,  Akihiko OIDE

IPC: H01F17/00 ,  H01F27/29

Abstract: A multilayer coil component includes: an element body having a pair of first side surfaces opposite to each other in a first direction and a pair of second side surfaces opposite to each other in a second direction orthogonal to the first direction; and a coil disposed inside the element body and having a coil axis extending in a third direction orthogonal to the first direction and the second direction, in which one of the pair of first side surfaces is a mounting surface, and a ratio of a first gap in the first direction between the coil and the mounting surface to a size of the element body in the first direction is 12 to 30% in a cross section viewed in the third direction.

公开(公告)号：US20220310312A1

公开(公告)日：2022-09-29

申请号：US17698561

申请日：2022-03-18

Applicant: TDK CORPORATION

Inventor： Akihiko OIDE ,  Makoto YOSHINO ,  Tomoki OKADA ,  Hideki SAITOU ,  Seiji OSADA ,  Kazuhiro EBINA ,  Kunio ODA ,  Takashi ABE ,  Akio SHIBATA ,  Kazuo IWAI

IPC: H01F27/29 ,  H01F27/28

Abstract: In the multi-layer coil component, the lead conductor is exposed from the end surface of the element body and is connected to the external electrode provided on the end surface. When the lead conductor is led out to the end surface of the element body, the lead area can be easily increased as compared with the case where the lead conductor is led out to the side surface of the element body. Therefore, by connecting the coil and the external electrode via the lead conductor, high connectivity between the coil and the external electrode is achieved.

公开(公告)号：US20240242883A1

公开(公告)日：2024-07-18

申请号：US18410188

申请日：2024-01-11

Applicant: TDK Corporation

Inventor： Yuya ISHIMA ,  Kenji KOMORITA ,  Shingo HATTORI ,  Yoji TOZAWA ,  Masaki TAKAHASHI ,  Hidenobu UMEDA ,  Yusuke NAGAI ,  Akihiko OIDE

IPC: H01F41/076 ,  H01F41/12

CPC classification number: H01F41/076 ,  H01F41/122

Abstract: A method for manufacturing a coil component including an element body, and a coil disposed inside the element body and including a first coil conductor and a second coil conductor having different shapes, the method comprises: applying a first photosensitive conductive paste on a substrate and exposing the first photosensitive conductive paste to light with a pattern corresponding to the first coil conductor to form a first curing pattern; after the forming of the first curing pattern, applying a second photosensitive conductive paste on the first photosensitive conductive paste and exposing the second photosensitive conductive paste to light with a pattern corresponding to the second coil conductor to form a second curing pattern; after the forming of the second curing pattern, developing portions of the first photosensitive conductive paste and the second photosensitive conductive paste that were not exposed; and after the developing, adding an insulating material on the substrate.

公开(公告)号：US20230005656A1

公开(公告)日：2023-01-05

申请号：US17945396

申请日：2022-09-15

Applicant: TDK CORPORATION

Inventor： Shinichi SATO ,  Yohei TADAKI ,  Akihiko OIDE ,  Yuma ISHIKAWA ,  Hidekazu SATO ,  Kazuhiro EBINA ,  Hiroyuki TANOUE

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

公开(公告)号：US20220310301A1

公开(公告)日：2022-09-29

申请号：US17696169

申请日：2022-03-16

Applicant: TDK Corporation

Inventor： Akihiko OIDE ,  Makoto YOSHINO ,  Tomoki OKADA ,  Seiji OSADA ,  Yuuki OKAZAKI ,  Takeshi SASAKI ,  Mitsuru ITO ,  Kenta SASAKI ,  Kazuhiro EBINA ,  Takashi ABE ,  Hiroshi ONO

IPC: H01F27/08 ,  H01F27/29 ,  H01F27/28

Abstract: In the multi-layer inductor, all of the plurality of through conductors are not aligned in a straight line, and the distance between the through conductors can be sufficiently kept in the element body having a predetermined dimensional standard. Therefore, the through conductor as a heat source is apart from each other, and the heat of the through conductor can be efficiently radiated to the outside of the element body.

公开(公告)号：US20230317351A1

公开(公告)日：2023-10-05

申请号：US18188534

申请日：2023-03-23

Applicant: TDK CORPORATION

Inventor： Masashi SHIMOYASU ,  Yoji TOZAWA ,  Akihiko OIDE ,  Daiki KATO ,  Midori KISHIMOTO ,  Satoshi TAKASU ,  Yo SAITO ,  Rui TAKAHASHI ,  Kenta SASAKI ,  Makoto YOSHINO ,  Kazuhiro EBINA

IPC: H01F27/28 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F27/292 ,  H01F2027/2809

Abstract: An electronic component has an element body; and an external electrode having a main body portion covering at least the second surface and a first wrapping-around portion wrapping around the third surface in the element body. The wrapping-around portion of the external electrode has a first part having a first distance, a second part having a second distance, a third part having a third distance, a fourth part having a fourth distance, and a fifth part having a fifth distance in the second direction in order from one side to the other side in the first direction. The second distance is longer than the first distance and the third distance. The fourth distance is longer than the third distance and the fifth distance.

公开(公告)号：US20220306541A1

公开(公告)日：2022-09-29

申请号：US17699972

申请日：2022-03-21

Applicant: TDK CORPORATION

Inventor： Kouichi KAKUDA ,  Takashi SUZUKI ,  Yukio TAKAHASHI ,  Kunihiko KAWASAKI ,  Hiroyuki TANOUE ,  Takehiro ISHII ,  Takuya NIIBORI ,  Takahiro SATO ,  Akihiko OIDE ,  Yasuhiro ITO ,  Takashi ENDO ,  Kunio ODA

IPC: C04B35/26

Abstract: A ferrite composition comprises a main component and a subcomponent. The main component includes 32.0 to 46.4 mol % of iron oxide in terms of Fe2O3, 4.4 to 14.0 mol % of copper oxide in terms of CuO, and 8.4 to 56.9 mol % of zinc oxide in terms of ZnO. The subcomponent includes 0.53 to 11.00 parts by weight of a silicon compound in terms of SiO2, 0.1 to 12.8 parts by weight of a tin compound in terms of SnO2, and 0.5 to 7.0 parts by weight of a bismuth compound in terms of Bi2O3, with respect to 100 parts by weight of the main component.

公开(公告)号：US20170025226A1

公开(公告)日：2017-01-26

申请号：US15215237

申请日：2016-07-20

Applicant: TDK CORPORATION

Inventor： Kouichi KAKUDA ,  Takashi SUZUKI ,  Masaki TAKAHASHI ,  Yukio TAKAHASHI ,  Shinichi KONDO ,  Asuka MURAI ,  Akihiko OIDE ,  Naoki UCHIDA ,  Hidekazu SATO

IPC: H01G4/40 ,  C04B37/00 ,  C04B35/462 ,  C04B35/453 ,  H01F1/03 ,  C04B35/47

CPC classification number: H01G4/40 ,  B32B18/00 ,  C04B35/265 ,  C04B35/453 ,  C04B35/462 ,  C04B35/47 ,  C04B2235/3232 ,  C04B2235/3236 ,  C04B2235/3262 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3409 ,  C04B2235/365 ,  C04B2235/6025 ,  C04B2237/34 ,  C04B2237/346 ,  H01F1/0306 ,  H01F1/0315 ,  H01F1/344 ,  H01F17/0013 ,  H01F27/255 ,  H01F2017/0026

Abstract: Composite electronic including coil, capacitor and intermediate parts, wherein coil part includes coil-conductor and magnetic-layer, capacitor part includes internal electrodes and dielectric-layer, which contains SrO—TiO2 or ZnO—TiO2 based oxide, intermediate part between coil and capacitor parts, intermediate part includes intermediate material layer, which contains ZnO, TiO2 and boron, ZnO contained in intermediate material layer 50-85 parts by mole and TiO2 contained the intermediate material layer 15-50 parts by mole when total content of ZnO and TiO2 in intermediate material layer is 100 parts by mole, content boron in intermediate material layer is 0.1-5.0 parts by weight of B2O3 when total of ZnO and TiO2 in intermediate material layer set to 100 parts by weight, part of ZnO and TiO2 intermediate material layer constitute ZnO—TiO2 compound, which in intermediate material layer is 50 wt % or more when total weight of ZnO and TiO2 in intermediate material layer is set to 100 wt %.

Abstract translation: 包括线圈，电容器和中间部件的复合电子器件，其中线圈部分包括线圈导体和磁层，电容器部分包括内部电极和介电层，其包含SrO-TiO2或ZnO-TiO2基氧化物，线圈和电容器之间的中间部分 中间部分包括中间材料层，其含有ZnO，TiO 2和硼，中间材料层中所含的ZnO为50-85份摩尔，当TiO 2和ZnO的总含量为 中间材料层为100份摩尔，中间材料层中的硼含量为0.1-5.0重量份的B2O3，当中间材料层中的ZnO和TiO 2的总量设定为100重量份时，部分ZnO和TiO 2中间材料层构成 ZnO-TiO2化合物，当中间材料层中的ZnO和TiO 2的总重量设定为10时，其在中间材料层中的重量比为50重量％ 0重量％。

公开(公告)号：US20220301761A1

公开(公告)日：2022-09-22

申请号：US17693810

申请日：2022-03-14

Applicant: TDK CORPORATION

Inventor： Akihiko OIDE ,  Makoto YOSHINO ,  Tomoki OKADA ,  Masashi SHIMOYASU ,  Daiki KATO ,  Hideki SAITOU ,  Seiji OSADA ,  Kazuhiro EBINA

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04 ,  H01F17/00

Abstract: In the multi-layer inductor, a through conductor provided in a sintered element body includes a pair of extracting conductors and a pair of internal conductors, and an end portion of the extracting conductor and an end portion of the internal conductor overlap each other in a stacking direction of the element body. Thus, the amount of shrinkage of each conductor during sintering of the element body is reduced, and internal stress generated in the element body after sintering is prevented.

公开(公告)号：US20220068565A1

公开(公告)日：2022-03-03

申请号：US17521500

申请日：2021-11-08

Applicant: TDK CORPORATION

Inventor： Yoji TOZAWA ,  Masashi SHIMOYASU ,  Makoto YOSHINO ,  Takuo ABE ,  Akihiko OIDE ,  Tsutomu ONO ,  Shinichi SATO ,  Makoto MORITA ,  Shinichi SATO ,  Hidekazu SATO

IPC: H01G4/232 ,  H01G4/252 ,  H01G13/00 ,  H05K1/03 ,  H01B1/22 ,  H01G4/30 ,  H03H7/42 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.