MULTI-LAYER COIL COMPONENT
    4.
    发明申请

    公开(公告)号:US20220319766A1

    公开(公告)日:2022-10-06

    申请号:US17701448

    申请日:2022-03-22

    申请人: TDK CORPORATION

    IPC分类号: H01F27/29 H01F17/00

    摘要: In the multi-layer coil component, the via conductor electrically connecting the coil layers adjacent to each other in the stacking direction of the element body protrudes from the coil region toward the side surface of the element body when viewed from the stacking direction of the element body. Therefore, the coil has a concave-convex portion. When a force is applied to the multi-layer coil component from the outside, the force is dispersed in the concave-convex portion of the coil, and thus defects are less likely to occur in the coil than in a coil in which the side of the side surfaces is flat.