- 专利标题： MULTICOMPONENT MODULE DESIGN AND FABRICATION
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申请号： US17209574申请日： 2021-03-23
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公开(公告)号： US20220308564A1公开(公告)日： 2022-09-29
- 发明人: Kirk D. Peterson , Steven Paul Ostrander , Stephanie E Allard , Charles L. Reynolds , Sungjun Chun , Daniel M. Dreps , Brian W. Quinlan , Sylvain Pharand , Jon Alfred Casey , David Edward Turnbull , Pascale Gagnon , Jean Labonte , Jean-Francois Bachand , Denis Blanchard
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： G05B19/418
- IPC分类号： G05B19/418
摘要：
Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically good element.
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