公开(公告)号：US20220308564A1

公开(公告)日：2022-09-29

申请号：US17209574

申请日：2021-03-23

申请人： International Business Machines Corporation

发明人： Kirk D. Peterson ,  Steven Paul Ostrander ,  Stephanie E Allard ,  Charles L. Reynolds ,  Sungjun Chun ,  Daniel M. Dreps ,  Brian W. Quinlan ,  Sylvain Pharand ,  Jon Alfred Casey ,  David Edward Turnbull ,  Pascale Gagnon ,  Jean Labonte ,  Jean-Francois Bachand ,  Denis Blanchard

IPC分类号： G05B19/418

摘要： Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically good element.