- 专利标题： MULTI-LAYER COIL COMPONENT
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申请号： US17698561申请日： 2022-03-18
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公开(公告)号： US20220310312A1公开(公告)日： 2022-09-29
- 发明人: Akihiko OIDE , Makoto YOSHINO , Tomoki OKADA , Hideki SAITOU , Seiji OSADA , Kazuhiro EBINA , Kunio ODA , Takashi ABE , Akio SHIBATA , Kazuo IWAI
- 申请人： TDK CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： TDK CORPORATION
- 当前专利权人： TDK CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2021-049717 20210324
- 主分类号： H01F27/29
- IPC分类号： H01F27/29 ; H01F27/28
摘要：
In the multi-layer coil component, the lead conductor is exposed from the end surface of the element body and is connected to the external electrode provided on the end surface. When the lead conductor is led out to the end surface of the element body, the lead area can be easily increased as compared with the case where the lead conductor is led out to the side surface of the element body. Therefore, by connecting the coil and the external electrode via the lead conductor, high connectivity between the coil and the external electrode is achieved.
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