METHOD OF MANUFACTURING LAMINATED COIL COMPONENT

    公开(公告)号:US20200234877A1

    公开(公告)日:2020-07-23

    申请号:US16843228

    申请日:2020-04-08

    申请人: TDK CORPORATION

    IPC分类号: H01F41/04 H01F27/28 H01F17/00

    摘要: A method of manufacturing a laminated coil component is a method of manufacturing a laminated coil component provided with a laminate obtained by laminating a coil conductor forming a spiral coil and an insulator layer. The method of manufacturing a laminated coil component includes a step of providing a conductor pattern configured to become a coil conductor on a green sheet configured to become an insulator layer, and a step of laminating a plurality of green sheets provided with the conductor pattern. The conductor pattern includes a pair of first side surfaces opposed to each other in an orthogonal direction orthogonal to a laminating direction of the green sheet. At the step of laminating a plurality of green sheets, a depression is formed on at least one of the pair of first side surfaces.

    MULTILAYER COIL COMPONENT
    3.
    发明申请

    公开(公告)号:US20220013278A1

    公开(公告)日:2022-01-13

    申请号:US17368332

    申请日:2021-07-06

    申请人: TDK CORPORATION

    摘要: A multilayer coil component includes an element body, first and second coils, and a pair of external electrodes. The element body includes a plurality of insulator layers laminated in a first direction. The element body has a pair of end surfaces opposing each other in a second direction orthogonal to the first direction. The first coil and the second coil are disposed in the element body and respectively have coil shafts along the second direction. The pair of external electrodes are disposed on the pair of end surfaces and electrically connected to both ends of the first coil and the second coil. The first coil includes a first conductor layer, a second conductor layer, and a first through hole conductor. The coil shaft of the first coil is disposed inside the second coil.

    MULTI-LAYER COIL COMPONENT
    4.
    发明申请

    公开(公告)号:US20220319766A1

    公开(公告)日:2022-10-06

    申请号:US17701448

    申请日:2022-03-22

    申请人: TDK CORPORATION

    IPC分类号: H01F27/29 H01F17/00

    摘要: In the multi-layer coil component, the via conductor electrically connecting the coil layers adjacent to each other in the stacking direction of the element body protrudes from the coil region toward the side surface of the element body when viewed from the stacking direction of the element body. Therefore, the coil has a concave-convex portion. When a force is applied to the multi-layer coil component from the outside, the force is dispersed in the concave-convex portion of the coil, and thus defects are less likely to occur in the coil than in a coil in which the side of the side surfaces is flat.