Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
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Application No.: US17377664Application Date: 2021-07-16
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Publication No.: US20220320347A1Publication Date: 2022-10-06
- Inventor: Neil Quinn Murray , Katherine H. Chiang , Chung-Te Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L27/12 ; H01L29/66

Abstract:
A semiconductor structure is provided. The semiconductor structure may include a transistor structure, the transistor structure may include a gate region arranged over an upper surface of a substrate and extending substantially in a first direction that is perpendicular to the upper surface of the substrate; a first source/drain region over the upper surface of the substrate; a second source/drain region over the upper surface of the substrate; and a channel region vertically extending in the first direction between the first source/drain region and the second source/drain region, wherein the channel region comprises an oxide semiconductor material. Along the first direction, the gate region covers a sidewall of the channel region.
Public/Granted literature
- US11843056B2 Semiconductor structure and manufacturing method thereof Public/Granted day:2023-12-12
Information query
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