SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20220320347A1

    公开(公告)日:2022-10-06

    申请号:US17377664

    申请日:2021-07-16

    Abstract: A semiconductor structure is provided. The semiconductor structure may include a transistor structure, the transistor structure may include a gate region arranged over an upper surface of a substrate and extending substantially in a first direction that is perpendicular to the upper surface of the substrate; a first source/drain region over the upper surface of the substrate; a second source/drain region over the upper surface of the substrate; and a channel region vertically extending in the first direction between the first source/drain region and the second source/drain region, wherein the channel region comprises an oxide semiconductor material. Along the first direction, the gate region covers a sidewall of the channel region.

Patent Agency Ranking