Invention Application
- Patent Title: EPITAXIAL DEPOSITION CHAMBER
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Application No.: US17223940Application Date: 2021-04-06
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Publication No.: US20220322492A1Publication Date: 2022-10-06
- Inventor: Shu-Kwan LAU , Brian Hayes BURROWS , Zhiyuan YE , Richard O. COLLINS , Enle CHOO , Danny D. WANG , Shainish NELLIKKA , Toshiyuki NAKAGAWA , Abhishek DUBE , Ala MORADIAN , Kartik Bhupendra SHAH
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H05B3/00
- IPC: H05B3/00

Abstract:
A process chamber includes a chamber body having a ceiling disposed above a floor with a chassis and an injector ring disposed therebetween. Upper and lower clamp rings secure the upper and floors, respectively, in place. An upper heating module is coupled to the upper clamp ring above the ceiling. A lower heating module is coupled to the lower clamp ring below the floor.
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