公开(公告)号：US20160068951A1

公开(公告)日：2016-03-10

申请号：US14522350

申请日：2014-10-23

申请人： Applied Materials, Inc.

发明人： Danny D. WANG ,  Jun Tae CHOI ,  Rupankar CHOUDHURY ,  Zhong Qiang HUA ,  Juan Carlos ROCHA-ALVAREZ ,  Jason Michael LAMB

IPC分类号： C23C16/44 ,  C23C16/50

CPC分类号： C23C16/4409 ,  B01J3/002 ,  B01J3/006 ,  C23C16/455 ,  C23C16/507

摘要： Alignment systems employing actuators provide relative displacement between lid assemblies of process chambers and substrates, and related methods are disclosed. A process chamber includes chamber walls defining a process volume in which a substrate may be placed and the walls support a lid assembly of the process chamber. The lid assembly contains at least one of an energy source and a process gas dispenser. Moreover, an alignment system may include at least one each of a bracket, an interface member, and an actuator. By attaching the bracket to the chamber wall and securing the interface member to the lid assembly, the actuator may communicate with the bracket and the interface member to provide relative displacement between the chamber wall and the lid assembly. In this manner, the lid assembly may be positioned relative to the substrate to improve process uniformity across the substrate within the process chamber.

摘要翻译： 使用致动器的对准系统提供了处理室和衬底的盖组件之间的相对位移，并且公开了相关方法。 处理室包括限定其中可以放置基底的处理体积的室壁，并且壁支撑处理室的盖组件。 盖组件包含能量源和工艺气体分配器中的至少一个。 此外，对准系统可以包括托架，接口构件和致动器中的至少一个。 通过将支架附接到室壁并将接口构件固定到盖组件，致动器可以与支架和接口构件连通，以在室壁和盖组件之间提供相对的位移。 以这种方式，盖组件可以相对于衬底定位，以提高处理室内的衬底上的工艺均匀性。

公开(公告)号：US20230341186A1

公开(公告)日：2023-10-26

申请号：US17730038

申请日：2022-04-26

申请人： Applied Materials, Inc.

发明人： Abraham PALATY ,  Vinodh RAMACHANDRAN ,  Shu-Kwan LAU ,  Shainish NELLIKKA ,  Raja Murali DHAMODHARAN ,  Danny D. WANG

IPC分类号： F28D1/02 ,  F28D1/047 ,  F28F1/24

CPC分类号： F28D1/0226 ,  F28D1/0477 ,  F28D1/024 ,  F28F1/24 ,  F28D2001/0286

摘要： A heating module for a substrate processing chamber includes heating lamps coupled to a reflector plate and a heat exchanger. The heat exchanger cools a gas within the heating module. A fan within the heating module circulates the gas through apertures in the reflector plate to cool the heating bulbs. The gas is cooled by the heat exchanger, and is recirculated. One or more shrouds directs the gas as the gas is being circulated.

公开(公告)号：US20220322492A1

公开(公告)日：2022-10-06

申请号：US17223940

申请日：2021-04-06

申请人： Applied Materials, Inc.

发明人： Shu-Kwan LAU ,  Brian Hayes BURROWS ,  Zhiyuan YE ,  Richard O. COLLINS ,  Enle CHOO ,  Danny D. WANG ,  Shainish NELLIKKA ,  Toshiyuki NAKAGAWA ,  Abhishek DUBE ,  Ala MORADIAN ,  Kartik Bhupendra SHAH

IPC分类号： H05B3/00

摘要： A process chamber includes a chamber body having a ceiling disposed above a floor with a chassis and an injector ring disposed therebetween. Upper and lower clamp rings secure the upper and floors, respectively, in place. An upper heating module is coupled to the upper clamp ring above the ceiling. A lower heating module is coupled to the lower clamp ring below the floor.

公开(公告)号：US20190390334A1

公开(公告)日：2019-12-26

申请号：US16561329

申请日：2019-09-05

申请人： Applied Materials, Inc.

发明人： Danny D. WANG ,  Jason Michael LAMB ,  Jun Tae CHOI ,  Rupankar CHOUDHURY ,  Zhong Qiang HUA ,  Juan Carlos ROCHA-ALVAREZ

IPC分类号： C23C16/44

摘要： Alignment systems employing actuators provide relative displacement between lid assemblies of process chambers and substrates, and related methods are disclosed. A process chamber includes chamber walls defining a process volume in which a substrate may be placed and the walls support a lid assembly of the process chamber. The lid assembly contains at least one of an energy source and a process gas dispenser. Moreover, an alignment system may include at least one each of a bracket, an interface member, and an actuator. By attaching the bracket to the chamber wall and securing the interface member to the lid assembly, the actuator may communicate with the bracket and the interface member to provide relative displacement between the chamber wall and the lid assembly. In this manner, the lid assembly may be positioned relative to the substrate to improve process uniformity across the substrate within the process chamber.