Invention Application
- Patent Title: FILM FOR METAL LAYER LAMINATE BOARD AND METAL LAYER LAMINATE BOARD
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Application No.: US17723534Application Date: 2022-04-19
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Publication No.: US20220332083A1Publication Date: 2022-10-20
- Inventor: Kanayo SAWASHI , Akihito MATSUTOMI , Masayuki HODONO
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2021-070655 20210419
- Main IPC: B32B5/18
- IPC: B32B5/18 ; B32B7/12 ; B32B15/04 ; B32B15/20 ; B32B15/18
Abstract:
A film for a metal layer laminate board and a metal layer laminate board have excellent stiffness, while capable of suppressing fluctuation of a dielectric constant before and after pressing. The film for a metal layer laminate board includes a porous resin layer having a tensile elastic modulus at 25° C. of 800 MPa or more and 2000 MPa or less.
Information query
