公开(公告)号：US20230189440A1

公开(公告)日：2023-06-15

申请号：US18056095

申请日：2022-11-16

Applicant: NITTO DENKO CORPORATION

Inventor： Kanayo SAWASHI ,  Akihito MATSUTOMI

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/115 ,  H05K3/4084 ,  H05K3/4623 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2203/107

Abstract: A wiring circuit board includes an insulating layer having a via penetrating in a thickness direction, a first conductive layer disposed on a one-side surface in the thickness direction of the insulating layer, a second conductive layer disposed on the other-side surface in the thickness direction of the insulating layer, and a conductive portion disposed on an inner peripheral surface of the via and electrically connecting the first and second conductive layers. Length L of 1 µm-10 µm inclusive, is measured by: drawing a segment joining first and second connection points from respectively, the one-side surface to the other-side surface in the thickness direction of the insulating layer and the inner peripheral surface in the cross-sectional view; identifying an outermost position farthest outward from the segment on the inner peripheral surface in the cross-sectional view; and measuring the length as the shortest distance from the segment to the outermost position.

公开(公告)号：US20220386453A1

公开(公告)日：2022-12-01

申请号：US17750999

申请日：2022-05-23

Applicant: NITTO DENKO CORPORATION

Inventor： Akihito MATSUTOMI ,  Kanayo SAWASHI

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/42 ,  H05K3/28

Abstract: A wiring circuit board includes a porous insulating layer, and a first conductive layer sequentially toward one side in the thickness direction. The first conductive layer includes a first signal wire and first ground wires. Each of the first ground wires is thicker than the first signal wire.

公开(公告)号：US20220332083A1

公开(公告)日：2022-10-20

申请号：US17723534

申请日：2022-04-19

Applicant: NITTO DENKO CORPORATION

Inventor： Kanayo SAWASHI ,  Akihito MATSUTOMI ,  Masayuki HODONO

IPC: B32B5/18 ,  B32B7/12 ,  B32B15/04 ,  B32B15/20 ,  B32B15/18

Abstract: A film for a metal layer laminate board and a metal layer laminate board have excellent stiffness, while capable of suppressing fluctuation of a dielectric constant before and after pressing. The film for a metal layer laminate board includes a porous resin layer having a tensile elastic modulus at 25° C. of 800 MPa or more and 2000 MPa or less.