Invention Application
- Patent Title: WORKPIECE PLACEMENT APPARATUS AND PROCESSING APPARATUS
-
Application No.: US17811121Application Date: 2022-07-07
-
Publication No.: US20220336257A1Publication Date: 2022-10-20
- Inventor: Yohei UCHIDA , Naoki SUGAWA , Katsushi ABE , Tsuyoshi HIDA
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Priority: JP2018-041231 20180307
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01J37/32 ; H01L21/67 ; H01L21/683
Abstract:
A placement apparatus for placing a workpiece is provided. The placement apparatus includes a stage on which a workpiece can be placed in a processing vessel; an edge ring including a locking part which is disposed on the stage so as to surround a periphery of the workpiece; a conductive connecting member connected with the edge ring at the locking part; and a first contacting member configured to cause the edge ring to contact the stage, while the edge ring is connected with the connecting member.
Public/Granted literature
- US11942357B2 Workpiece placement apparatus and processing apparatus Public/Granted day:2024-03-26
Information query
IPC分类:
