Invention Application
- Patent Title: METHOD OF MANUFACTURING MICROELECTRONIC DEVICES AND RELATED MICROELECTRONIC DEVICES, TOOLS, AND APPARATUS
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Application No.: US17231313Application Date: 2021-04-15
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Publication No.: US20220336280A1Publication Date: 2022-10-20
- Inventor: Brandon P. Wirz , Andrew M. Bayless
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L23/544 ; H01L21/326 ; H01L21/67
Abstract:
Microelectronic devices may include an active surface and a side surface. The side surface may include a first portion having a reflective surface and a second portion having a non-reflective surface. The reflective surface may be formed by depositing a conductive material in trenches formed in material of the wafer along streets between the microelectronic devices on a wafer. The conductive material may be heated. The wafer may be cooled after the conductive material is heated fracturing the wafer along the streets and separating the microelectronic devices.
Information query
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