Invention Application
- Patent Title: WAFER ADAPTORS, INCLUDING SYSTEMS AND METHODS, FOR ADAPTING DIFFERENT SIZED WAFERS
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Application No.: US17722416Application Date: 2022-04-18
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Publication No.: US20220336283A1Publication Date: 2022-10-20
- Inventor: Enrique Jr Sarile , Chee Kay Chow , Dzafir Bin Mohd Shariff
- Applicant: UTAC Headquarters Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: UTAC Headquarters Pte. Ltd.
- Current Assignee: UTAC Headquarters Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/683 ; H01L21/67

Abstract:
A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by the plasma, an adhesive sheet attached to a bottom surface of the primary wafer ring, and an adapted sized wafer disposed on the adhesive sheet between the primary wafer ring and the adapted sized wafer. A system for assembling and disassembling the wafer adaptor ring assembly is also disclosed.
Information query
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