Invention Application
- Patent Title: BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHODS OF FORMING THE SAME
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Application No.: US17809991Application Date: 2022-06-30
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Publication No.: US20220336394A1Publication Date: 2022-10-20
- Inventor: Kensuke ISHIKAWA , Shingo TOTANI , Fumitaka AMANO , Rahul SHARANGPANI
- Applicant: SANDISK TECHNOLOGIES LLC
- Applicant Address: US TX ADDISON
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX ADDISON
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A bonded assembly includes a first semiconductor die that includes first metallic bonding structures embedded within a first bonding-level dielectric layer, and a second semiconductor die that includes second metallic bonding structures embedded within a second bonding-level dielectric layer and bonded to the first metallic bonding structures by metal-to-metal bonding. One of the first metallic bonding structures a pad portion, and a via portion located between the pad portion and the first semiconductor device, the via portion having second tapered sidewalls.
Information query
IPC分类:
