Invention Application
- Patent Title: APPARATUS INCLUDING SOLDER-CORE CONNECTORS AND METHODS OF MANUFACTURING THE SAME
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Application No.: US17231847Application Date: 2021-04-15
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Publication No.: US20220336397A1Publication Date: 2022-10-20
- Inventor: Po Chih Yang , Po Chen Kuo , Chih Hong Wang
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/488 ; H01L23/532
Abstract:
Semiconductor devices including continuous-core connectors and associated systems and methods are disclosed herein. The continuous-core connectors each include a peripheral wall that surrounds an inner-core configured to provide an electrical path using uniform material.
Public/Granted literature
- US11705421B2 Apparatus including solder-core connectors and methods of manufacturing the same Public/Granted day:2023-07-18
Information query
IPC分类:
