公开(公告)号：US11705421B2

公开(公告)日：2023-07-18

申请号：US17231847

申请日：2021-04-15

Applicant: Micron Technology, Inc.

Inventor： Po Chih Yang ,  Po Chen Kuo ,  Chih Hong Wang

IPC: H01L23/00 ,  H01L23/488 ,  H01L23/532

CPC classification number: H01L24/14 ,  H01L23/488 ,  H01L23/53228

Abstract: Semiconductor devices including continuous-core connectors and associated systems and methods are disclosed herein. The continuous-core connectors each include a peripheral wall that surrounds an inner-core configured to provide an electrical path using uniform material.

公开(公告)号：US20220336397A1

公开(公告)日：2022-10-20

申请号：US17231847

申请日：2021-04-15

Applicant: Micron Technology, Inc.

Inventor： Po Chih Yang ,  Po Chen Kuo ,  Chih Hong Wang

IPC: H01L23/00 ,  H01L23/488 ,  H01L23/532

Abstract: Semiconductor devices including continuous-core connectors and associated systems and methods are disclosed herein. The continuous-core connectors each include a peripheral wall that surrounds an inner-core configured to provide an electrical path using uniform material.

公开(公告)号：US20220068666A1

公开(公告)日：2022-03-03

申请号：US17007607

申请日：2020-08-31

Applicant: Micron Technology, Inc.

Inventor： Jungbae Lee ,  Chih Hong Wang

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31

Abstract: Underfill materials with graded moduli for semiconductor device assemblies, and associated methods and systems are disclosed. In one embodiment, the underfill material between a semiconductor die and a package substrate includes a matrix material, first filler particles with a first size distribution, and second filler particles with a second size distribution different than the first size distribution. Centrifugal force may be applied to the underfill material to arrange the first and second filler particles such that the underfill material may form a first region having a first elastic modulus and a second region having a second elastic modulus different than the first elastic modulus. Once the underfill material is cured, portions of conductive pillars coupling the semiconductor die with the package substrate may be surrounded by the first region, and conductive pads of the package substrate may be surrounded by the second region.

公开(公告)号：US11682563B2

公开(公告)日：2023-06-20

申请号：US17850978

申请日：2022-06-27

Applicant: Micron Technology, Inc.

Inventor： Jungbae Lee ,  Chih Hong Wang

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L21/563 ,  H01L23/295 ,  H01L23/3157 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05147 ,  H01L2224/05647 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/8192

Abstract: Underfill materials with graded moduli for semiconductor device assemblies, and associated methods and systems are disclosed. In one embodiment, the underfill material between a semiconductor die and a package substrate includes a matrix material, first filler particles with a first size distribution, and second filler particles with a second size distribution different than the first size distribution. Centrifugal force may be applied to the underfill material to arrange the first and second filler particles such that the underfill material may form a first region having a first elastic modulus and a second region having a second elastic modulus different than the first elastic modulus. Once the underfill material is cured, portions of conductive pillars coupling the semiconductor die with the package substrate may be surrounded by the first region, and conductive pads of the package substrate may be surrounded by the second region.

公开(公告)号：US20220328326A1

公开(公告)日：2022-10-13

申请号：US17850978

申请日：2022-06-27

Applicant: Micron Technology, Inc.

Inventor： Jungbae Lee ,  Chih Hong Wang

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31

Abstract: Underfill materials with graded moduli for semiconductor device assemblies, and associated methods and systems are disclosed. In one embodiment, the underfill material between a semiconductor die and a package substrate includes a matrix material, first filler particles with a first size distribution, and second filler particles with a second size distribution different than the first size distribution. Centrifugal force may be applied to the underfill material to arrange the first and second filler particles such that the underfill material may form a first region having a first elastic modulus and a second region having a second elastic modulus different than the first elastic modulus. Once the underfill material is cured, portions of conductive pillars coupling the semiconductor die with the package substrate may be surrounded by the first region, and conductive pads of the package substrate may be surrounded by the second region.