- 专利标题： Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof
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申请号： US16919065申请日： 2020-07-01
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公开(公告)号： US20220345602A9公开(公告)日： 2022-10-27
- 发明人: Mingzhu WANG , Bojie ZHAO , Takehiko Tanaka , Feifan CHEN , Qimin MEI , Liang DING , Heng JIANG
- 申请人： NINGBO SUNNY OPOTECH CO., LTD.
- 申请人地址： CN Ningbo
- 专利权人： NINGBO SUNNY OPOTECH CO., LTD.
- 当前专利权人： NINGBO SUNNY OPOTECH CO., LTD.
- 当前专利权人地址： CN Ningbo
- 优先权： CN201610142925.9 20160312,CN201610143457.7 20160312,CN201610148338.0 20160315,CN201610149444.0 20160315
- 主分类号： H04N5/225
- IPC分类号： H04N5/225 ; H01L27/146 ; H04N13/239
摘要：
A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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