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公开(公告)号：US12117664B2
公开(公告)日：2024-10-15
申请号：US17270213
申请日：2019-07-17
发明人： Takehiko Tanaka , Liefeng Chen , Lin Liu , Chunmei Liu
IPC分类号： G02B7/02
摘要： The present application provides an optical lens, comprising: a first lens component, a second lens component and a first glue material. A first lens sheet group of the first lens component and a second lens sheet group of the second lens component together constitutes an imageable optical system, wherein a second lens barrel of the second lens component has an outer top surface and an inner top surface, and the second lens sheet group bears against the inner top surface. The outer top surface comprises a glue spreading surface suitable for arranging the first glue material and an extension surface formed by extending from the glue spreading surface to a central axis of the second lens barrel, there is a first thickness from the glue spreading surface to the inner top surface, there is a second thickness from the extension surface to the inner top surface, and the first thickness is greater than the second thickness. The present application further provides a corresponding camera module and an assembling method. The present application can improve the mechanical strength and reliability of the black object of the second lens component, can improve the yield of the optical lens or the camera module, and contributes to the miniaturization of the camera module.
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公开(公告)号：US12055786B2
公开(公告)日：2024-08-06
申请号：US17268191
申请日：2019-07-10
发明人： Takehiko Tanaka , Heng Jiang , Lin Liu , Liefeng Chen
摘要： A lens group assembly includes a lens barrel and a plurality of lenses. The lenses are embedded in the lens barrel to assemble the lens group, and there is an adhesive material between at least two of the lenses and/or between at least one of the lenses and the lens barrel to reinforce the structural strength of the assembled lens group. A corresponding optical lens, a camera module and a lens group assembling method are also included. Assembling accuracy and assembling stability of the high-sensitivity multi-lens optical system is improved by increasing the adhesion between the lenses. Variation of the optical lens is reduced based on an active calibration process. Adhesive material that might otherwise overflow is accommodated. Defects caused by the assembly of the optical lens are reduced based on the active calibration process, especially the field curvature and peak variation.
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公开(公告)号：US12022180B2
公开(公告)日：2024-06-25
申请号：US17488876
申请日：2021-09-29
发明人： Mingzhu Wang , Bojie Zhao , Zhenyu Chen , Nan Guo , Takehiko Tanaka
CPC分类号： H04N23/57 , G01N15/0656 , G03B17/02 , H04M1/0264 , H04N23/54 , H04N23/55
摘要： The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.
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公开(公告)号：US11843009B2
公开(公告)日：2023-12-12
申请号：US16637895
申请日：2018-08-08
发明人： Takehiko Tanaka , Zhenyu Chen , Zhewen Mei
IPC分类号： H01L27/146 , B29C45/14 , B29C45/37 , H04N23/55 , B29L11/00
CPC分类号： H01L27/14618 , B29C45/14336 , B29C45/37 , H01L27/14627 , H01L27/14683 , H04N23/55 , B29C2793/009 , B29L2011/00
摘要： Disclosed a photosensitive assembly, an imaging module, a smart terminal, and a method and a mould for manufacturing the photosensitive assembly. The photosensitive assembly comprises: a circuit board having a rectangular-shaped rigid board region and comprising a flexible board extension portion extending from the rigid board region, wherein the rigid board region has a lamination side and a non-lamination side, and the rigid board region has a lamination region on the lamination side; a photosensitive element mounted in the rigid board region of the circuit board; and a molded portion formed on the rigid board region, surrounding the photosensitive element, and extending towards the photosensitive element and coming into contact with the photosensitive element, the molded portion having an inner side surface, an outer side surface and a top surface, the molded portion not covering the lamination region of the rigid board region, and the top surface having a flat portion, wherein the top surface of a part of the molded portion on the lamination side has a descending portion, the descending portion is located between the flat portion and the outer side surface of the molded portion and is lower than the flat portion, and the outer side surface of a part of the molded portion on the non-lamination side is perpendicular to the flat portion.
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公开(公告)号：US11824071B2
公开(公告)日：2023-11-21
申请号：US17678347
申请日：2022-02-23
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Bojie Zhao , Takehiko Tanaka , Zhen Huang , Zhongyu Luan , Heng Jiang
IPC分类号： H01L27/146 , H04N23/00 , H04N23/54 , H04N23/57 , H01L23/00
CPC分类号： H01L27/14618 , H01L23/562 , H01L24/48 , H01L27/1469 , H01L27/14627 , H01L27/14634 , H01L27/14636 , H01L27/14685 , H04N23/00 , H04N23/54 , H04N23/57 , H01L24/45 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/45139 , H01L2924/00014 , H01L2224/45144 , H01L2924/00014 , H01L2224/45147 , H01L2924/00014
摘要： A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.
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公开(公告)号：US11664397B2
公开(公告)日：2023-05-30
申请号：US17707051
申请日：2022-03-29
发明人： Takehiko Tanaka , Bojie Zhao , Zhewen Mei , Nan Guo
IPC分类号： H01L27/146 , H04N5/225
CPC分类号： H01L27/1461 , H01L27/14623 , H01L27/14625 , H04N5/2253 , H04N5/2254 , H04N5/2257
摘要： Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to said third portion surface; a third angle between the third partial surface and the optical axis is greater than a fourth angle between the fourth partial surface and the optical axis.
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公开(公告)号：US20220345602A9
公开(公告)日：2022-10-27
申请号：US16919065
申请日：2020-07-01
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko Tanaka , Feifan CHEN , Qimin MEI , Liang DING , Heng JIANG
IPC分类号： H04N5/225 , H01L27/146 , H04N13/239
摘要： A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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公开(公告)号：US11363184B2
公开(公告)日：2022-06-14
申请号：US17203673
申请日：2021-03-16
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
IPC分类号： H04N5/225 , B29C45/14 , B29C33/44 , G02B19/00 , G02B7/10 , B29C70/72 , B29C70/88 , G02B13/00 , H05K1/02 , H05K1/18 , H05K3/28 , B29C43/18 , B29C43/36 , B29C43/52 , G02B7/02 , B29L31/34 , B29C45/40 , B29C45/00 , B29D11/00 , B29L31/00 , B29K101/12
摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
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公开(公告)号：US11315967B2
公开(公告)日：2022-04-26
申请号：US16651455
申请日：2018-09-19
发明人： Takehiko Tanaka , Bojie Zhao , Zhewen Mei , Nan Guo
IPC分类号： H01L27/146 , H04N5/225
摘要： Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof.
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公开(公告)号：US11223751B2
公开(公告)日：2022-01-11
申请号：US16747455
申请日：2020-01-20
发明人： Mingzhu Wang , Zhenyu Chen , Takehiko Tanaka , Zhongyu Luan , Bojie Zhao , Zhen Huang , Nan Guo , Fengsheng Xi , Heng Jiang , Zilong Deng
IPC分类号： H04N5/225
摘要： A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
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