Invention Application
- Patent Title: EPOXY CONDUCTIVE PASTE AND PREPARATION METHOD AND APPLICATION THEREOF
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Application No.: US17413564Application Date: 2020-01-17
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Publication No.: US20220348799A1Publication Date: 2022-11-03
- Inventor: Wen Shi , Fengzhen Sun , Dein Ll
- Applicant: Soltrium Advanced Materials Technology, Ltd
- Applicant Address: CN Shenzhen
- Assignee: Soltrium Advanced Materials Technology, Ltd
- Current Assignee: Soltrium Advanced Materials Technology, Ltd
- Current Assignee Address: CN Shenzhen
- International Application: PCT/CN2020/072632 WO 20200117
- Main IPC: C09J11/04
- IPC: C09J11/04 ; C09J11/06 ; C09J163/00 ; C08K3/08 ; C08K9/02 ; C08K5/5415 ; C08K7/00 ; C09J9/02

Abstract:
An epoxy conductive paste is disclosed, based on 100 parts by total mass, comprising the following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, and 0.4˜5 parts of cationic curing agent; wherein, the conductive particles include conductive particles with a three-dimensional dendritic microstructure. The conductive paste of the disclosure has the characteristics of good conductivity, short curing time, strong adhesion, and capability for long-term operation at room temperature.
Public/Granted literature
- US12006447B2 Epoxy conductive paste and preparation method and application thereof Public/Granted day:2024-06-11
Information query
IPC分类: