公开(公告)号：US20220348799A1

公开(公告)日：2022-11-03

申请号：US17413564

申请日：2020-01-17

Applicant: Soltrium Advanced Materials Technology, Ltd

Inventor： Wen Shi ,  Fengzhen Sun ,  Dein Ll

IPC: C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C08K3/08 ,  C08K9/02 ,  C08K5/5415 ,  C08K7/00 ,  C09J9/02

Abstract: An epoxy conductive paste is disclosed, based on 100 parts by total mass, comprising the following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, and 0.4˜5 parts of cationic curing agent; wherein, the conductive particles include conductive particles with a three-dimensional dendritic microstructure. The conductive paste of the disclosure has the characteristics of good conductivity, short curing time, strong adhesion, and capability for long-term operation at room temperature.