Invention Application
- Patent Title: MULTILAYER CERAMIC ELECTRONIC COMPONENT
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Application No.: US17858370Application Date: 2022-07-06
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Publication No.: US20220351909A1Publication Date: 2022-11-03
- Inventor: Min Gon LEE , Seung Woo SONG , Jae Yeol CHOI , Jin Kyung JOO , Taek Jung LEE , Jin Man JUNG
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2018-0046195 20180420,KR10-2018-0090639 20180803
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G4/12 ; H01G4/224

Abstract:
A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.
Public/Granted literature
- US12020868B2 Multilayer ceramic electronic component Public/Granted day:2024-06-25
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