COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING AGENT
Abstract:
Disclosed herein is a composition including copper ions and at least one additive including a polyalkyleneimine backbone including N-hydrogen atoms, where (a) the polyalkyleneimine backbone has a mass average molecular weight MW of from 600 g/mol to 100 000 g/mol, (b) the N-hydrogen atoms are each substituted by a polyoxyalkylene group including an oxyethylene and a C3 to C6 oxyalkylene unit, and (c) the average number of oxyalkylene units in the polyoxyalkylene groups is of from more than 10 to less than 30 per N-hydrogen atom in the polyalkyleneimine.
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