Invention Application
- Patent Title: COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING AGENT
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Application No.: US17754110Application Date: 2020-09-15
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Publication No.: US20220356592A1Publication Date: 2022-11-10
- Inventor: Marco ARNOLD , Alexander FLUEGEL , Charlotte EMNET , Nadine ENGELHARDT
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen am Rhein
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen am Rhein
- Priority: EP19200135.2 20190927
- International Application: PCT/EP2020/075765 WO 20200915
- Main IPC: C25D5/00
- IPC: C25D5/00 ; C25D5/16 ; C25D7/12

Abstract:
Disclosed herein is a composition including copper ions and at least one additive including a polyalkyleneimine backbone including N-hydrogen atoms, where (a) the polyalkyleneimine backbone has a mass average molecular weight MW of from 600 g/mol to 100 000 g/mol, (b) the N-hydrogen atoms are each substituted by a polyoxyalkylene group including an oxyethylene and a C3 to C6 oxyalkylene unit, and (c) the average number of oxyalkylene units in the polyoxyalkylene groups is of from more than 10 to less than 30 per N-hydrogen atom in the polyalkyleneimine.
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