Invention Application
- Patent Title: Integrated Assemblies and Methods Forming Integrated Assemblies
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Application No.: US17669189Application Date: 2022-02-10
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Publication No.: US20220358971A1Publication Date: 2022-11-10
- Inventor: Che-Chi Lee , Terrence B. McDaniel , Kehao Zhang , Albert P. Chan , Clement Jacob , Luca Fumagalli , Vinay Nair
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: G11C5/10
- IPC: G11C5/10 ; H01L27/108 ; H01L49/02 ; G11C11/405 ; H01L27/06

Abstract:
Some embodiments include an integrated assembly having first and second source/drain regions laterally offset from one another. Metal silicide is adjacent to lateral surfaces of the source/drain regions. Metal is adjacent to the metal silicide. Container-shaped first and second capacitor electrodes are coupled to the source/drain regions through the metal silicide and the metal. Capacitor dielectric material lines interior surfaces of the container-shaped first and second capacitor electrodes, A shared capacitor electrode extends vertically between the first and second capacitor electrodes, and extends into the lined first and second capacitor electrodes. Some embodiments include methods of forming integrated assemblies.
Public/Granted literature
- US11915777B2 Integrated assemblies and methods forming integrated assemblies Public/Granted day:2024-02-27
Information query