Invention Application
- Patent Title: INTEGRATED SEMICONDUCTOR DIE VESSEL PROCESSING WORKSTATIONS
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Application No.: US17874174Application Date: 2022-07-26
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Publication No.: US20220359248A1Publication Date: 2022-11-10
- Inventor: Tsung-Sheng KUO , Guan-Wei HUANG , Chih-Hung HUANG , Yang-Ann CHU , Hsu-Shui LIU , Jiun-Rong PAI
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu City
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu City
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/66 ; H01L21/02
Abstract:
In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.
Public/Granted literature
- US11721572B2 Integrated semiconductor die vessel processing workstations Public/Granted day:2023-08-08
Information query
IPC分类:
