Invention Application
- Patent Title: GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
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Application No.: US17870099Application Date: 2022-07-21
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Publication No.: US20220359355A1Publication Date: 2022-11-10
- Inventor: Shang-Yun Hou , Hsien-Pin Hu , Sao-Ling Chiu , Wen-Hsin Wei , Ping-Kang Huang , Chih-Ta Shen , Szu-Wei Lu , Ying-Ching Shih , Wen-Chih Chiou , Chi-Hsi Wu , Chen-Hua Yu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L21/48 ; H01L23/31 ; H01L21/56
Abstract:
A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.
Public/Granted literature
- US11967546B2 Giga interposer integration through Chip-On-Wafer-On-Substrate Public/Granted day:2024-04-23
Information query
IPC分类:
