Invention Application
- Patent Title: LOW DEFECT, HIGH MOBILITY THIN FILM TRANSISTORS WITH IN-SITU DOPED METAL OXIDE CHANNEL MATERIAL
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Application No.: US17308856Application Date: 2021-05-05
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Publication No.: US20220359759A1Publication Date: 2022-11-10
- Inventor: Chieh-Jen Ku , Andre Baran , Bernhard Sell , David Goldstein , Timothy Jen
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/51 ; H01L27/12 ; H01L29/66 ; H01L21/02

Abstract:
Transistors with metal oxide channel material that is in-situ doped for desired charge carrier concentrations. The metal oxide channel material may be deposited by atomic layering of multiple constituent metals with an oxidation of each layer. Such an ALD process may be performed by cyclically depositing a precursor of one of the metals upon a substrate during a deposition phase, and oxidizing the absorbed precursor during an oxidation phase. For a quinary metal oxide, each of three metal precursors may be introduced and oxidized during the ALD process, and charge carrier concentrations may be modulated by further introducing a fourth metal precursor during the ALD process in a manner that disperses this dopant metal within the film at a significantly lower chemical concentration than the other metals.
Information query
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