Invention Application
- Patent Title: HIGH DENSITY PINLESS TWINAX INTERCONNECT
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Application No.: US17653466Application Date: 2022-03-04
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Publication No.: US20220360005A1Publication Date: 2022-11-10
- Inventor: Mike SAPOZHNIKOV , Sayed Ashraf MAMUN , Tomer OSI , Amendra KOUL , David NOZADZE , Upendranadh R. KARETI , Joel R. GOERGEN
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H01R12/72
- IPC: H01R12/72 ; H01R12/75

Abstract:
Certain aspects of the present disclosure provide techniques for pinless interconnect for twinaxial cables to an IC. This includes a socket coupled to an integrated circuit (IC), a port structure coupled to the socket, and a ground connector inserted into the port structure. It further includes a twinaxial cable including a pair of conductors inserted through the ground connector to establish an electrical connection between the twinaxial cable and the IC.
Public/Granted literature
- US11777239B2 Twinaxial cable port structure coupled to an integrated circuit socket Public/Granted day:2023-10-03
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