公开(公告)号：US20230378677A1

公开(公告)日：2023-11-23

申请号：US18300956

申请日：2023-04-14

Applicant: Cisco Technology, Inc.

Inventor： Mike SAPOZHNIKOV ,  Sayed Ashraf MAMUN ,  D. Brice ACHKIR ,  David NOZADZE ,  Amendra KOUL ,  Upendranadh R. KARETI

IPC: H01R13/24 ,  H01B11/18 ,  H01R43/00

CPC classification number: H01R13/2414 ,  H01B11/18 ,  H01R43/007

Abstract: A communication interconnect system is described. The system may include a co-packaged cables (CPC) tile with a slot formed from a first surface to slot surface at a first depth in the CPC tile and a plurality of channels formed between the slot surface and a second surface opposite the first surface. The system may also include a twinaxial cable with a pair of conductors positioned in the slot such that the pair of conductors are inserted in a pair of channels of the plurality of channels to establish an electrical connection between the twinaxial cable and the pair of channels. The system also includes a plurality of elastomer pins positioned in the plurality of channels adjacent to the second surface.

公开(公告)号：US20220359366A1

公开(公告)日：2022-11-10

申请号：US17446729

申请日：2021-09-02

Applicant: Cisco Technology, Inc.

Inventor： Mike SAPOZHNIKOV ,  Sayed Ashraf MAMUN ,  Tomer OSI ,  Amendra KOUL ,  David NOZADZE ,  Upendranadh R. KARETI ,  Joel R. GOERGEN

IPC: H01L23/50 ,  H01L23/367 ,  H01L23/498

Abstract: An apparatus includes an integrated circuit package and a heatsink. The integrated circuit package includes a substrate, an integrated circuit, a first plurality of signal conductors, and a second plurality of signal conductors. The substrate includes a first surface and a second surface opposite the first surface. The integrated circuit is coupled to the first surface of the substrate. The first plurality of signal conductors are arranged along a periphery of the first surface of the substrate. The second plurality of signal conductors are arranged along a periphery of the second surface of the substrate. The heatsink includes a first portion positioned along the first surface of the substrate and a second portion positioned along the second surface of the substrate.

公开(公告)号：US20220360005A1

公开(公告)日：2022-11-10

申请号：US17653466

申请日：2022-03-04

Applicant: Cisco Technology, Inc.

Inventor： Mike SAPOZHNIKOV ,  Sayed Ashraf MAMUN ,  Tomer OSI ,  Amendra KOUL ,  David NOZADZE ,  Upendranadh R. KARETI ,  Joel R. GOERGEN

IPC: H01R12/72 ,  H01R12/75

Abstract: Certain aspects of the present disclosure provide techniques for pinless interconnect for twinaxial cables to an IC. This includes a socket coupled to an integrated circuit (IC), a port structure coupled to the socket, and a ground connector inserted into the port structure. It further includes a twinaxial cable including a pair of conductors inserted through the ground connector to establish an electrical connection between the twinaxial cable and the IC.