公开(公告)号：US20230050002A1

公开(公告)日：2023-02-16

申请号：US17445054

申请日：2021-08-13

Applicant: Cisco Technology, Inc.

Inventor： D. Brice ACHKIR ,  Mark C. NOWELL ,  Upendranadh R. KARETI

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L23/12 ,  H01L23/50 ,  H01L51/50

Abstract: Embodiments presented in this disclosure generally relate to techniques for interconnecting integrated circuits. More specifically, embodiments disclosed herein provide a back mounted interposer (BMI) to facilitate interconnecting of integrated circuits. One example apparatus includes an integrated circuit, an interposer, and a circuit board, at least a portion of the circuit board being disposed between the integrated circuit and the interposer, where the circuit board is configured to provide electrical connection between the interposer and the integrated circuit via connection elements on a first surface of the interposer. The apparatus also includes an interface on a second surface of the interposer, the interface being configured to provide signals from the integrated circuit to an electrical component.

公开(公告)号：US20230378677A1

公开(公告)日：2023-11-23

申请号：US18300956

申请日：2023-04-14

Applicant: Cisco Technology, Inc.

Inventor： Mike SAPOZHNIKOV ,  Sayed Ashraf MAMUN ,  D. Brice ACHKIR ,  David NOZADZE ,  Amendra KOUL ,  Upendranadh R. KARETI

IPC: H01R13/24 ,  H01B11/18 ,  H01R43/00

CPC classification number: H01R13/2414 ,  H01B11/18 ,  H01R43/007

Abstract: A communication interconnect system is described. The system may include a co-packaged cables (CPC) tile with a slot formed from a first surface to slot surface at a first depth in the CPC tile and a plurality of channels formed between the slot surface and a second surface opposite the first surface. The system may also include a twinaxial cable with a pair of conductors positioned in the slot such that the pair of conductors are inserted in a pair of channels of the plurality of channels to establish an electrical connection between the twinaxial cable and the pair of channels. The system also includes a plurality of elastomer pins positioned in the plurality of channels adjacent to the second surface.

公开(公告)号：US20220359366A1

公开(公告)日：2022-11-10

申请号：US17446729

申请日：2021-09-02

Applicant: Cisco Technology, Inc.

Inventor： Mike SAPOZHNIKOV ,  Sayed Ashraf MAMUN ,  Tomer OSI ,  Amendra KOUL ,  David NOZADZE ,  Upendranadh R. KARETI ,  Joel R. GOERGEN

IPC: H01L23/50 ,  H01L23/367 ,  H01L23/498

Abstract: An apparatus includes an integrated circuit package and a heatsink. The integrated circuit package includes a substrate, an integrated circuit, a first plurality of signal conductors, and a second plurality of signal conductors. The substrate includes a first surface and a second surface opposite the first surface. The integrated circuit is coupled to the first surface of the substrate. The first plurality of signal conductors are arranged along a periphery of the first surface of the substrate. The second plurality of signal conductors are arranged along a periphery of the second surface of the substrate. The heatsink includes a first portion positioned along the first surface of the substrate and a second portion positioned along the second surface of the substrate.

公开(公告)号：US20220360005A1

公开(公告)日：2022-11-10

申请号：US17653466

申请日：2022-03-04

Applicant: Cisco Technology, Inc.

Inventor： Mike SAPOZHNIKOV ,  Sayed Ashraf MAMUN ,  Tomer OSI ,  Amendra KOUL ,  David NOZADZE ,  Upendranadh R. KARETI ,  Joel R. GOERGEN

IPC: H01R12/72 ,  H01R12/75

Abstract: Certain aspects of the present disclosure provide techniques for pinless interconnect for twinaxial cables to an IC. This includes a socket coupled to an integrated circuit (IC), a port structure coupled to the socket, and a ground connector inserted into the port structure. It further includes a twinaxial cable including a pair of conductors inserted through the ground connector to establish an electrical connection between the twinaxial cable and the IC.