RESIN COMPOSITION, PREPREG, RESIN-ATTACHED FILM, RESIN-ATTACHED METAL FOIL, METAL-CLADDED LAMINATE SHEET, AND WIRING BOARD
Abstract:
A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in the molecule, and a curing agent. In Formula (1), R1 represents a hydrogen atom or an alkyl group.
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