公开(公告)号：US20250136741A1

公开(公告)日：2025-05-01

申请号：US18703589

申请日：2022-10-17

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuji YAMADA ,  Eiichiro SAITO ,  Hiroyuki FUJISAWA ,  Takahiro YAMADA

IPC: C08F290/06 ,  B32B15/08 ,  C08F290/04 ,  C08K3/36 ,  C08K5/3415 ,  C08K9/04

Abstract: The present disclosure provides a thermosetting resin composition contributing to reducing the elastic modulus of a cured product and increasing the flexibility thereof while reducing the chances of causing a decline in the heat resistance of the cured product. A thermosetting resin composition contains: a maleimide compound (A) having at least two maleimide groups in one molecule; a compound (B) having, at either or both of terminals thereof, a substituent with an ethylenic unsaturated bond and having a polyphenylene ether skeleton; and an inorganic filler (C). The compound (B) includes a compound (B1) having a butadiene-derived structural unit.

公开(公告)号：US20220363798A1

公开(公告)日：2022-11-17

申请号：US17621148

申请日：2020-06-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Takahiro YAMADA ,  Hiroyuki FUJISAWA ,  Yuji YAMADA

IPC: C08F290/06 ,  C08G65/38 ,  C08G61/10 ,  C08K5/3415 ,  C08K5/3492 ,  C08K5/13 ,  C08F222/10 ,  C08K5/5397 ,  C08K5/5313 ,  C08J5/24 ,  B32B15/08 ,  B32B27/26

Abstract: A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in the molecule, and a curing agent. In Formula (1), R1 represents a hydrogen atom or an alkyl group.