Invention Application
- Patent Title: METHODS TO SELECTIVELY EMBED MAGNETIC MATERIALS IN SUBSTRATE AND CORRESPONDING STRUCTURES
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Application No.: US17873518Application Date: 2022-07-26
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Publication No.: US20220367104A1Publication Date: 2022-11-17
- Inventor: Cheng XU , Kyu-Oh LEE , Junnan ZHAO , Rahul JAIN , Ji Yong PARK , Sai VADLAMANI , Seo Young KIM
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/02 ; H01F27/24

Abstract:
Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.
Public/Granted literature
- US12154715B2 Methods to selectively embed magnetic materials in substrate and corresponding structures Public/Granted day:2024-11-26
Information query