Invention Application
- Patent Title: METHODS AND DEVICES USING MICROCHANNELS FOR INTERCONNECTIONS
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Application No.: US17754028Application Date: 2020-09-17
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Publication No.: US20220367325A1Publication Date: 2022-11-17
- Inventor: Kayla C. Niccum , Ankit Mahajan , Saagar A. Shah , Kara A. Meyers , Mikhail L. Pekurovsky , Jonathan W. Kemling , David C. Mercord , Pranati Mondkar
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- International Application: PCT/IB2020/058677 WO 20200917
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L23/31
Abstract:
A pattern of microchannels is formed on a major surface of a substrate on the side opposite an adhesive surface thereof. Through holes extend through the substrate and are connected to the pattern of microchannels. Solid circuit dies are adhesively bonded to the adhesive surface of the substrate. The contact pads of the solid circuit dies at least partially overlie and face the through holes. Electrically conductive channel traces are formed to electrically connect to the solid circuit dies via the through holes.
Public/Granted literature
- US12205882B2 Methods and devices using microchannels for interconnections Public/Granted day:2025-01-21
Information query
IPC分类:
