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公开(公告)号：US20240151646A1
公开(公告)日：2024-05-09
申请号：US18549244
申请日：2022-04-07
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Xuexue Guo , Henrik B. van Lengerich , Joshua M. Fishman , Karl K. Stensvad , Cedric Bedoya , Caleb T. Nelson , Kayla C. Niccum , John A. Wheatley , Jeffrey L. Solomon , Johah Shaver
CPC classification number: G01N21/6428 , G01N21/6456 , G01N33/525 , G01N2021/6439
Abstract: Luminescent imaging films (100) for fluorescent enhancement and methods of making and using the same are provided. The films (100) include a flexible carrier layer (1109, and a pattern of photonic structure (120) disposed on the flexible carrier layer, which is interspersed with an anti-biofouling material (130) to provide a pattern of analyte sites (132). The pattern of photonic structure includes a patterned high-refractive-index dielectric material surface (123) so as to provide resonance at the excitation or emission wavelength to enhance a fluorescence signal from labeled analytes.
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公开(公告)号：US11699865B2
公开(公告)日：2023-07-11
申请号：US17594688
申请日：2020-05-01
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Kayla C. Niccum , Ankit Mahajan , Mikhail L. Pekurovsky , Nicholas T. Gabriel , Roger W. Barton , Kara A. Meyers , Saagar A. Shah , Jonathan W. Kemling , Richard C. Webb
Abstract: Flexible electrical connectors are provided to electrically connect electronic devices. The flexible electrical connector includes a removable adhesive tape strip having an adhesive surface thereof and an electrically conductive trace disposed on the adhesive tape strip. The flexible electrical connector engages an electronic device to form an electrical contact where the adhesive tape strip has an adhesive surface removably adhesively bonded to the substrate of the electronic device to at least partially cover the electrical contact.
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公开(公告)号：US20220037278A1
公开(公告)日：2022-02-03
申请号：US17309705
申请日：2019-12-23
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Saagar A. Shah , Daniel B. Taylor , Mikhail L. Pekurovsky , Kara A. Meyers , Kayla C. Niccum , David J. Rowe , Gino L. Pitera
Abstract: An article includes a solid circuit die on a first major surface of a substrate, wherein the solid circuit die includes an arrangement of contact pads, and wherein at least a portion of the contact pads in the arrangement of contact pads are at least partially exposed on the first major surface of the substrate to provide an arrangement of exposed contact pads; a guide layer including an arrangement of microchannels, wherein the guide layer contacts the first major surface of the substrate such that at least some microchannels in the arrangement of microchannels overlie the at least some exposed contact pads in the arrangement of exposed contact pads; and a conductive particle-containing liquid in at least some of the microchannels. Other articles and methods of manufacturing the articles are described.
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公开(公告)号：US12156343B2
公开(公告)日：2024-11-26
申请号：US17758989
申请日：2021-01-22
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Mikhail L Pekurovsky , Kara A. Meyers , Saagar A. Shah , Kayla C. Niccum
Abstract: Devices including electrical connections to embedded electronic components and methods of making the same are provided. The devices include a flexible electronic component buried inside a substrate. The free end of the flexible electronic component can be extracted to stick out of the major plane of the substrate as a projecting contact.
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5.发明公开公开(公告)号：US20230193074A1
公开(公告)日：2023-06-22
申请号：US17925336
申请日：2021-06-07
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Thomas P. Klun , Matthew R.D. Smith , Henrik B. van Lengerich , Kayla C. Niccum , Christopher S. Lyons
IPC: C09D175/16 , C08G18/67 , C08G18/81
CPC classification number: C09D175/16 , C08G18/678 , C08G18/6755 , C08G18/81
Abstract: A compound is described having following formula: (I) Also described is a mixture of compounds comprising the reaction product of i) a urethane compound comprising a perfluorooxyalkyl moiety and at least two (meth)acryl groups; and ii) a silane compound comprising hydrolysable groups and a group selected from amine or mercapto group; wherein i) and ii) are reacted at an equivalent ratio of excess compound i) such that (meth)acryl groups remain unreacted. Methods and articles are also described.
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Patent Agency Ranking
公开(公告)号：US20220209436A1
公开(公告)日：2022-06-30
申请号：US17594688
申请日：2020-05-01
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Kayla C. Niccum , Ankit Mahajan , Mikhail L. Pekurovsky , Nicholas T. Gabriel , Roger W. Barton , Kara A. Meyers , Saagar A. Shah , Jonathan W. Kemling , Richard C. Webb
Abstract: Flexible electrical connectors are provided to electrically connect electronic devices. The flexible electrical connector includes a removable adhesive tape strip having an adhesive surface thereof and an electrically conductive trace disposed on the adhesive tape strip. The flexible electrical connector engages an electronic device to form an electrical contact where the adhesive tape strip has an adhesive surface removably adhesively bonded to the substrate of the electronic device to at least partially cover the electrical contact.
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公开(公告)号：US20220189790A1
公开(公告)日：2022-06-16
申请号：US17594346
申请日：2020-04-14
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R.D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
Abstract: A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
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公开(公告)号：US12097498B2
公开(公告)日：2024-09-24
申请号：US18259177
申请日：2021-11-24
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Henrik B. van Lengerich , Caleb T. Nelson , Kayla C. Niccum , Jeffrey L. Solomon , Paul B. Armstrong , Joshua M. Fishman , Tonya D. Bonilla , Phillip D. Hustad , David J. Tarnowski
CPC classification number: B01L3/502761 , B01L3/502707 , B29D11/00788 , G01N21/6428 , B01L2200/0647 , B01L2300/0636 , B01L2300/0819 , B01L2300/0893 , B01L2300/16 , G01N2021/6439
Abstract: An article includes a flexible structured film with a first major surface and a second major surface, wherein a first major surface of the flexible structured film has a plurality of posts separated by land areas, and the posts have an exposed surface. An anti-biofouling layer resides in the land areas, and the anti-biofouling layer has a methylated surface. An inorganic layer is on the exposed surfaces of the posts, wherein the inorganic layer includes a metal or a metal oxide. An analyte binding layer is on the inorganic layer, wherein the analyte binding layer is chosen from a reactive silane, a functionalizable hydrogel, a functionalizable polymer, and mixtures and combinations thereof. An exposed surface of the analyte binding layer includes at least one functional group selected to bind with a biochemical analyte.
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公开(公告)号：US20240282592A1
公开(公告)日：2024-08-22
申请号：US18652529
申请日：2024-05-01
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R.D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
CPC classification number: H01L21/56 , H01L23/293 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L2224/03312 , H01L2224/0332 , H01L2224/03505 , H01L2224/03515 , H01L2224/04105 , H01L2224/05567
Abstract: A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
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公开(公告)号：US20220367325A1
公开(公告)日：2022-11-17
申请号：US17754028
申请日：2020-09-17
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Kayla C. Niccum , Ankit Mahajan , Saagar A. Shah , Kara A. Meyers , Mikhail L. Pekurovsky , Jonathan W. Kemling , David C. Mercord , Pranati Mondkar
IPC: H01L23/498 , H01L23/00 , H01L23/31
Abstract: A pattern of microchannels is formed on a major surface of a substrate on the side opposite an adhesive surface thereof. Through holes extend through the substrate and are connected to the pattern of microchannels. Solid circuit dies are adhesively bonded to the adhesive surface of the substrate. The contact pads of the solid circuit dies at least partially overlie and face the through holes. Electrically conductive channel traces are formed to electrically connect to the solid circuit dies via the through holes.
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