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公开(公告)号：US11699865B2
公开(公告)日：2023-07-11
申请号：US17594688
申请日：2020-05-01
发明人： Kayla C. Niccum , Ankit Mahajan , Mikhail L. Pekurovsky , Nicholas T. Gabriel , Roger W. Barton , Kara A. Meyers , Saagar A. Shah , Jonathan W. Kemling , Richard C. Webb
摘要： Flexible electrical connectors are provided to electrically connect electronic devices. The flexible electrical connector includes a removable adhesive tape strip having an adhesive surface thereof and an electrically conductive trace disposed on the adhesive tape strip. The flexible electrical connector engages an electronic device to form an electrical contact where the adhesive tape strip has an adhesive surface removably adhesively bonded to the substrate of the electronic device to at least partially cover the electrical contact.
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公开(公告)号：US20220037278A1
公开(公告)日：2022-02-03
申请号：US17309705
申请日：2019-12-23
发明人： Ankit Mahajan , Saagar A. Shah , Daniel B. Taylor , Mikhail L. Pekurovsky , Kara A. Meyers , Kayla C. Niccum , David J. Rowe , Gino L. Pitera
摘要： An article includes a solid circuit die on a first major surface of a substrate, wherein the solid circuit die includes an arrangement of contact pads, and wherein at least a portion of the contact pads in the arrangement of contact pads are at least partially exposed on the first major surface of the substrate to provide an arrangement of exposed contact pads; a guide layer including an arrangement of microchannels, wherein the guide layer contacts the first major surface of the substrate such that at least some microchannels in the arrangement of microchannels overlie the at least some exposed contact pads in the arrangement of exposed contact pads; and a conductive particle-containing liquid in at least some of the microchannels. Other articles and methods of manufacturing the articles are described.
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公开(公告)号：US11114599B2
公开(公告)日：2021-09-07
申请号：US16498478
申请日：2018-03-22
发明人： Ankit Mahajan , Mikhail L. Pekurovsky , Matthew S. Stay , Shawn C. Dodds , Thomas J. Metzler , Matthew R. D. Smith , Saagar A. Shah , Jae Yong Lee , James F. Poch , Roger W. Barton
IPC分类号： H01L35/04 , H01L35/34 , H01L35/32 , H01L21/762 , H01L21/768 , H01L21/603
摘要： Electronic devices including a layer of polymeric material and solid semiconductor dies partially embedded in the layer are provided. The dies have first ends projecting away from the first major surface of the layer. The electronic devices can be formed by sinking the first ends of the dies into a major surface of a liner. A flowable polymeric material is filled into the space between the dies and solidified to form the layer of polymeric material. The first ends of the dies are exposed by delaminating the liner from the first ends of the dies. Electrical conductors are provided on the layer to connect the first ends of the dies.
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公开(公告)号：US20210235586A1
公开(公告)日：2021-07-29
申请号：US16948657
申请日：2019-03-27
发明人： Teresa M. Goeddel , Ankit Mahajan , Mikhail L. Pekurovsky , Thomas J. Metzler , Saagar A. Shah , Kara A. Meyers , Jonathan W. Kemling , Jeremy K. Larsen
摘要： Processes of making an electrical jumper (120) for electrical devices are provided. A micro-replication stamp (300) is used to press a layer of curable material (124) on a circuit substrate (102) to make patterned features. A conductive liquid (230) is disposed into the patterned features to make electrically conductive traces (126) that pass over a circuitry (110) and connect electrical contacts (122A, 122B). In some cases, the stamp (300) has a standoff (310).
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公开(公告)号：US11894164B2
公开(公告)日：2024-02-06
申请号：US16948540
申请日：2020-09-23
发明人： Ankit Mahajan , James Zhu , Saagar A. Shah , Mikhail L. Pekurovsky , Vivek Krishnan , Kevin T. Reddy , Christopher B. Walker, Jr. , Michael A. Kropp , Kara A. Meyers , Teresa M. Goeddel , Thomas J. Metzler , Jonathan W. Kemling , Roger W. Barton
IPC分类号： H05K1/02 , H01B7/06 , H01B7/02 , H01B13/00 , H01B13/008
CPC分类号： H01B7/06 , H01B7/0225 , H01B13/008 , H01B13/0013 , H05K1/0283 , Y10T29/49162
摘要： A stretchable conductor includes a substrate with a first major surface, wherein the substrate is an elastomeric material. An elongate wire is on the first major surface of the substrate; the wire includes a first end and a second end, and further includes at least one arcuate region between the first end and the second end. At least one portion of the arcuate region of the wire in the region has a first surface area portion embedded in the surface of the substrate and a second surface area portion unembedded on the substrate and exposed in an amount sufficient to render at least an area of the substrate in the region electrically conductive. The unembedded second surface portion of the arcuate region may lie above or below a plane of the substrate. Composite articles including a stretchable conductor in durable electrical contact with a conductive fabric are also disclosed.
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公开(公告)号：US20220209436A1
公开(公告)日：2022-06-30
申请号：US17594688
申请日：2020-05-01
发明人： Kayla C. Niccum , Ankit Mahajan , Mikhail L. Pekurovsky , Nicholas T. Gabriel , Roger W. Barton , Kara A. Meyers , Saagar A. Shah , Jonathan W. Kemling , Richard C. Webb
摘要： Flexible electrical connectors are provided to electrically connect electronic devices. The flexible electrical connector includes a removable adhesive tape strip having an adhesive surface thereof and an electrically conductive trace disposed on the adhesive tape strip. The flexible electrical connector engages an electronic device to form an electrical contact where the adhesive tape strip has an adhesive surface removably adhesively bonded to the substrate of the electronic device to at least partially cover the electrical contact.
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公开(公告)号：US20220189790A1
公开(公告)日：2022-06-16
申请号：US17594346
申请日：2020-04-14
发明人： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R.D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
摘要： A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
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公开(公告)号：US11229987B2
公开(公告)日：2022-01-25
申请号：US17250673
申请日：2019-08-15
发明人： Joseph B. Eckel , Nicholas T. Gabriel , Ankit Mahajan , Mikhail L. Pekurovsky , Kara A. Meyers , Thomas J. Metzler , Saagar A. Shah
摘要： A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.
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公开(公告)号：US20200105440A1
公开(公告)日：2020-04-02
申请号：US16621021
申请日：2018-06-07
发明人： Ankit Mahajan, Jr. , James Zhu , Saagar A. Shah , Mikhail L. Pekurovsky , Vivek Krishnan , Kevin T. Reddy , Christopher B. Walker, Jr. , Michael A. Kropp , Kara A. Meyers , Teresa M. Goeddel , Thomas J. Metzler , Jonathan W. Kemling , Roger W. Barton
IPC分类号： H01B7/06 , H01B7/02 , H01B13/00 , H01B13/008
摘要： A stretchable conductor includes a substrate with a first major surface and an elongate wire, wherein the substrate is an elastomeric material, the elongate wire is on the first major surface of the substrate, the wire includes a first end and a second end, and further includes at least one arcuate region between the first end and the second end. At least one portion of the arcuate region of the wire in the region has a first surface area portion embedded in the surface of the substrate and a second surface area portion unembedded on the substrate and exposed in an amount sufficient to render at least an area of the substrate in the region electrically conductive. The unembedded second surface portion of the arcuate region may lie above or below a plane of the substrate. Additionally, different methods of preparing said stretchable conductor are disclosed. Composite articles including said stretchable conductor in durable electrical contact with a conductive fabric are also disclosed.
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公开(公告)号：US12020951B2
公开(公告)日：2024-06-25
申请号：US17594346
申请日：2020-04-14
发明人： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R. D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
CPC分类号： H01L21/56 , H01L23/293 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L2224/03312 , H01L2224/0332 , H01L2224/03505 , H01L2224/03515 , H01L2224/04105 , H01L2224/05567
摘要： A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
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