Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
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Application No.: US17484039Application Date: 2021-09-24
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Publication No.: US20220376111A1Publication Date: 2022-11-24
- Inventor: Kan-Ju Lin , Chien Chang , Chih-Shiun Chou , TaiMin Chang , Hung-Yi Huang , Chih-Wei Chang , Ming-Hsing Tsai , Lin-Yu Huang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/08 ; H01L29/66 ; H01L21/768

Abstract:
A semiconductor device includes a gate structure on a semiconductor fin, a dielectric layer on the gate structure, and a gate contact extending through the dielectric layer to the gate structure. The gate contact includes a first conductive material on the gate structure, a top surface of the first conductive material extending between sidewalls of the dielectric layer, and a second conductive material on the top surface of the first conductive material.
Information query
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