Invention Application
- Patent Title: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
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Application No.: US17885362Application Date: 2022-08-10
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Publication No.: US20220384218A1Publication Date: 2022-12-01
- Inventor: Mana TANABE , Kosuke TAKAI , Kenji MASUI , Kaori UMEZAWA
- Applicant: KIOXIA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KIOXIA CORPORATION
- Current Assignee: KIOXIA CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2019-048424 20190315
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B7/00 ; H01L21/02
Abstract:
A substrate processing method includes a process of cooling a substrate to below a freezing point of a processing liquid using a cooling fluid brought into contact with the substrate opposite. While the substrate is cooled to below the freezing point of the processing liquid, a droplet of processing liquid is dispensed onto a surface of the substrate at a specified location of a foreign substance. The droplet then forms a frozen droplet portion at the specified location. The frozen droplet portion is then thawed.
Public/Granted literature
- US11776823B2 Substrate processing method and substrate processing apparatus Public/Granted day:2023-10-03
Information query
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