Invention Application
- Patent Title: STEAM TREATMENT STATIONS FOR CHEMICAL MECHANICAL POLISHING SYSTEM
-
Application No.: US17889330Application Date: 2022-08-16
-
Publication No.: US20220388041A1Publication Date: 2022-12-08
- Inventor: Haosheng Wu , Jianshe Tang , Hari Soundararajan , Shou-Sung Chang , Hui Chen , Chih Chung Chou , Alexander John Fisher , Paul D. Butterfield
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: B08B3/10
- IPC: B08B3/10 ; H01L21/67 ; B24B37/34
Abstract:
An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.
Public/Granted literature
- US12030093B2 Steam treatment stations for chemical mechanical polishing system Public/Granted day:2024-07-09
Information query
IPC分类:
