Invention Application
- Patent Title: MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS
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Application No.: US17932401Application Date: 2022-09-15
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Publication No.: US20230008292A1Publication Date: 2023-01-12
- Inventor: Randon K. Richards , Aparna U. Limaye , Owen R. Fay , Dong Soon Lim
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L25/18 ; H01L23/00 ; H01L23/552 ; H01L23/64 ; H01L21/78 ; H01L21/66 ; H01L25/00 ; H01L23/66 ; H01Q1/22 ; H01Q1/48
Abstract:
Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.
Public/Granted literature
- US11948921B2 Methods of forming stacked semiconductors die assemblies Public/Granted day:2024-04-02
Information query
IPC分类:
