Invention Application
- Patent Title: HEAT RADIATING MEMBER AND ELECTRONIC DEVICE INCLUDING SAME
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Application No.: US17862205Application Date: 2022-07-11
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Publication No.: US20230008679A1Publication Date: 2023-01-12
- Inventor: Yunjeong PARK , Kyungha KOO , Dongku KANG , Jihong KIM , Haein CHUNG
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0090398 20210709
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20 ; G02B27/01

Abstract:
Various embodiments of the disclosure relate to a heat radiating structure and an electronic device including the same. According to various embodiments of the disclosure, it is possible to provide an electronic device including: a housing including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a third surface enclosing an internal space between the first surface and the second surface, wherein at least one portion of the third surface faces a third direction different from the first direction and the second direction, wherein a first opening is formed in the first surface, and a second opening is formed in the third surface; a substrate disposed in the internal space; an electronic component disposed on at least one surface of the substrate; and a mesh member disposed in the internal space and disposed adjacent to the first opening and the second opening.
Information query