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    ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE
    1.
    发明申请
    ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE 有权

    公开(公告)号：US20210410268A1

    公开(公告)日：2021-12-30

    申请号：US17293280

    申请日：2019-11-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hongki MOON ,  Yoonsun PARK ,  Seunghoon KANG ,  Kyungha KOO ,  Seyoung JANG ,  Woojune JUNG

    IPC: H05K1/02 ,  H05K1/14 ,  H05K7/20

    Abstract: Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.

    HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME
    2.
    发明申请
    HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME 有权

    公开(公告)号：US20210392787A1

    公开(公告)日：2021-12-16

    申请号：US17289285

    申请日：2019-11-01

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Haein CHUNG ,  Kyungha KOO ,  Seungjae BAE ,  Hyunjoong YOON ,  Jaeho CHUNG ,  Yongwon CHO

    IPC: H05K7/20 ,  G06F1/20 ,  H05K9/00

    Abstract: An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.

    HEAT TRANSFER MEMBER AND ELECTRONIC DEVICE INCLUDING THE SAME
    3.
    发明申请
    HEAT TRANSFER MEMBER AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20200267828A1

    公开(公告)日：2020-08-20

    申请号：US16795223

    申请日：2020-02-19

    Applicant: Samsung Electronics Co, Ltd

    Inventor： Hongki MOON ,  Yoonsun PARK ,  Seunghoon KANG ,  Kyungha KOO ,  Hajoong YUN ,  Seungjoo LEE ,  Yeonjoo LEE ,  Seyoung JANG

    IPC: H05K1/02 ,  H02J50/27

    Abstract: An electronic device for improving heat transfer is provided. The electronic device includes a housing, a display mounted on at least one surface of the housing, a battery, a supporting member disposed adjacent to a back surface of the display and supporting the display, a printed circuit board on which electronic components are mounted, a shield can surrounding at least a portion of the electronic components, a shielding structure disposed on an outer surface of the shield can to shield the electronic components, and a first heat transfer member disposed on an outer surface of the shielding structure and including a partial area that faces at least one electronic component among the plurality of electronic components mounted on the printed circuit board and another partial area that is bent and faces another electronic component among the plurality of electronic components mounted on the printed circuit board.

    ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE
    5.
    发明申请
    ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE 有权

    公开(公告)号：US20250155944A1

    公开(公告)日：2025-05-15

    申请号：US19023947

    申请日：2025-01-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Joseph AHN ,  Kyungha KOO ,  Hongki MOON

    IPC: G06F1/20 ,  G06F1/16 ,  H04M1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/04 ,  H05K7/20

    Abstract: According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.

    HEAT RADIATING MEMBER AND ELECTRONIC DEVICE INCLUDING SAME
    6.
    发明申请
    HEAT RADIATING MEMBER AND ELECTRONIC DEVICE INCLUDING SAME 有权

    公开(公告)号：US20230008679A1

    公开(公告)日：2023-01-12

    申请号：US17862205

    申请日：2022-07-11

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yunjeong PARK ,  Kyungha KOO ,  Dongku KANG ,  Jihong KIM ,  Haein CHUNG

    IPC: G06F1/20 ,  H05K7/20 ,  G02B27/01

    Abstract: Various embodiments of the disclosure relate to a heat radiating structure and an electronic device including the same. According to various embodiments of the disclosure, it is possible to provide an electronic device including: a housing including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a third surface enclosing an internal space between the first surface and the second surface, wherein at least one portion of the third surface faces a third direction different from the first direction and the second direction, wherein a first opening is formed in the first surface, and a second opening is formed in the third surface; a substrate disposed in the internal space; an electronic component disposed on at least one surface of the substrate; and a mesh member disposed in the internal space and disposed adjacent to the first opening and the second opening.

    ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE
    8.
    发明申请
    ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE 有权

    公开(公告)号：US20210055059A1

    公开(公告)日：2021-02-25

    申请号：US17094293

    申请日：2020-11-10

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Haejin LEE ,  Kyungha KOO ,  Chunghyo JUNG ,  Se-Young JANG ,  Jungje BANG ,  Jaeheung YE ,  Chi-Hyun CHO

    IPC: F28D15/02 ,  G06F1/20 ,  H04M1/02 ,  H05K7/20 ,  H05K9/00 ,  H01L23/427

    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

    ELECTRONIC DEVICE COMPRISING THERMAL MANAGEMENT CHAMBER USING BOILING
    10.
    发明公开
    ELECTRONIC DEVICE COMPRISING THERMAL MANAGEMENT CHAMBER USING BOILING 审中-公开

    公开(公告)号：US20230413484A1

    公开(公告)日：2023-12-21

    申请号：US18461141

    申请日：2023-09-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Joseph AHN ,  Kyungha KOO ,  Hongki MOON

    IPC: H05K7/20 ,  G06F1/20 ,  H04M1/02

    CPC classification number: H05K7/20336 ,  H05K7/2099 ,  G06F1/203 ,  H04M1/0266 ,  G06F2200/201

    Abstract: An electronic device according to various embodiments comprises: a housing including a heat source and a thermal management chamber thermally coupled to the heat source; and a display disposed on the housing on the opposite side from the heat source. The thermal management chamber includes a working fluid, and is configured to generate bubbles in the working fluid at or above the boiling critical temperature of the working fluid. The thermal management chamber may include: a first wall located adjacent to the heat source and having a first hydrophilic surface; a second wall located on the opposite side from the first wall and spaced apart from the heat source, and having a second hydrophobic surface, and a plurality of third walls located between the first wall and the second wall.

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