Invention Publication
- Patent Title: Semiconductor Device and Method
-
Application No.: US18154087Application Date: 2023-01-13
-
Publication No.: US20230140968A1Publication Date: 2023-05-11
- Inventor: Shih-Hang Chiu , Chung-Chiang Wu , Jo-Chun Hung , Wei-Cheng Wang , Kuan-Ting Liu , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L29/786 ; H01L21/02 ; H01L29/66 ; H01L21/8238 ; H01L21/28

Abstract:
Semiconductor devices having improved gate electrode structures and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a gate structure over a semiconductor substrate, the gate structure including a high-k dielectric layer; an n-type work function layer over the high-k dielectric layer; an anti-reaction layer over the n-type work function layer, the anti-reaction layer including a dielectric material; a p-type work function layer over the anti-reaction layer, the p-type work function layer covering top surfaces of the anti-reaction layer; and a conductive cap layer over the p-type work function layer.
Public/Granted literature
- US12148810B2 Semiconductor device and method Public/Granted day:2024-11-19
Information query
IPC分类: