Invention Publication
- Patent Title: HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET
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Application No.: US17915062Application Date: 2021-03-26
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Publication No.: US20230141072A1Publication Date: 2023-05-11
- Inventor: Yuichi MORI , Naoki TAYA
- Applicant: LINTEC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: LINTEC CORPORATION
- Current Assignee: LINTEC CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 20063528 2020.03.31
- International Application: PCT/JP2021/012958 2021.03.26
- Date entered country: 2022-09-27
- Main IPC: C09J7/35
- IPC: C09J7/35 ; C09J123/12 ; C09J11/04

Abstract:
A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM/DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM/DP2 of the dielectric property DPM of the intermediate layer to dielectric property DP2 of the second adhesive layer are each less than one, and the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tanδ/ε’r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively. tanδ denotes a dielectric dissipation factor at 23° C. and a frequency of 40.68 MHz and ε‘r denotes a relative permittivity at 23° C. and the frequency of 40.68 MHz.
Public/Granted literature
- US3172343A Treadway and method of forming Public/Granted day:1965-03-09
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