公开(公告)号：US20230159795A1

公开(公告)日：2023-05-25

申请号：US17915042

申请日：2021-03-26

Applicant: LINTEC CORPORATION

Inventor： Yuichi MORI ,  Naoki TAYA

IPC: C09J7/35 ,  C09J11/04

CPC classification number: C09J7/35 ,  C09J11/04 ,  C09J2301/416 ,  C09J2301/124 ,  C09J2301/408 ,  C09J2301/304

Abstract: A high-frequency dielectric heating adhesive sheet includes: a first adhesive layer; a second adhesive layer; and an intermediate layer located between the first adhesive layer and the second adhesive layer, the first adhesive layer containing a first thermoplastic resin and a first dielectric filler configured to generate heat in response to a high-frequency wave, the second adhesive layer containing a second thermoplastic resin and a second dielectric filler configured to generate heat in response to the high-frequency wave, the intermediate layer containing no dielectric filler in response to the high-frequency wave.

公开(公告)号：US20170015870A1

公开(公告)日：2017-01-19

申请号：US15121135

申请日：2015-02-23

Applicant: LINTEC Corporation

Inventor： Kenta NISHIJIMA ,  Yuichi MORI ,  Yoshiaki HAGIHARA

IPC: C09J4/06 ,  H01L51/52 ,  H01L51/00 ,  B32B7/12 ,  C09J7/02

CPC classification number: C09J4/06 ,  B32B7/12 ,  B32B27/06 ,  B32B27/18 ,  B32B27/30 ,  B32B2307/412 ,  B32B2307/726 ,  B32B2307/7265 ,  B32B2457/00 ,  B32B2457/206 ,  B32B2581/00 ,  C09J7/20 ,  C09J7/381 ,  C09J123/22 ,  C09J2203/326 ,  C09J2423/00 ,  C09J2433/00 ,  C09J2451/00 ,  C09J2467/005 ,  H01L51/004 ,  H01L51/0043 ,  H01L51/5246

Abstract: The present invention is an adhesive composition including a Polyisobutylene-based resin (A), an energy ray-curable resin (B), and a tackifier (C), the energy ray-curable resin (B) including a difunctional acrylate that includes a divalent alicyclic hydrocarbon group, the adhesive composition including the energy ray-curable resin (B) in a ratio of 5 to 59 parts by mass based on 100 parts by mass of the Polyisobutylene-based resin (A), and including the tackifier (C) in a ratio of 0.1 to 40 parts by mass based on 100 parts by mass of the Polyisobutylene-based resin (A); and an adhesive sheet including a release sheet, and an adhesive layer that is formed on the release sheet, the adhesive layer being formed using the adhesive composition; and an electronic device including a transparent substrate, a device, and a sealing material, the sealing material being formed using the adhesive composition.

Abstract translation: 本发明是一种包含聚异丁烯类树脂（A），能量射线固化性树脂（B）和增粘剂（C）的粘合剂组合物，所述能量射线固化性树脂（B）含有双官能丙烯酸酯， 二价脂环族烃基，相对于100质量份的聚异丁烯类树脂（A），含有能量射线固化性树脂（B）的粘合剂组合物的比例为5〜59质量份，并且包含增粘剂（C ）相对于聚异丁烯系树脂（A）100质量份为0.1〜40质量份。 以及包含剥离片的粘合片和形成在剥离片上的粘合剂层，使用粘合剂组合物形成粘合剂层; 以及包括透明基板，装置和密封材料的电子装置，所述密封材料使用所述粘合剂组合物形成。

公开(公告)号：US20230141072A1

公开(公告)日：2023-05-11

申请号：US17915062

申请日：2021-03-26

Applicant: LINTEC CORPORATION

Inventor： Yuichi MORI ,  Naoki TAYA

IPC: C09J7/35 ,  C09J123/12 ,  C09J11/04

CPC classification number: C09J7/35 ,  C09J11/04 ,  C09J123/12 ,  C09J2301/304 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/1242

Abstract: A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM/DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM/DP2 of the dielectric property DPM of the intermediate layer to dielectric property DP2 of the second adhesive layer are each less than one, and the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tanδ/ε’r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively. tanδ denotes a dielectric dissipation factor at 23° C. and a frequency of 40.68 MHz and ε‘r denotes a relative permittivity at 23° C. and the frequency of 40.68 MHz.

公开(公告)号：US20240392166A1

公开(公告)日：2024-11-28

申请号：US18696248

申请日：2022-09-21

Applicant: LINTEC Corporation

Inventor： Yuichi MORI ,  Naoki TAYA

IPC: C09J7/35 ,  C09J9/00 ,  C09J11/08

Abstract: A high-frequency dielectric heating adhesive contains a thermoplastic resin and a cyano group-containing organic compound, and the high-frequency dielectric heating adhesive satisfies (1) below: (1) the high-frequency dielectric heating adhesive has a total luminous transmittance of 50% or more as measured in accordance with JIS K 7361-1:1997.