Invention Publication
- Patent Title: PRINTED CIRCUIT BOARD
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Application No.: US17691772Application Date: 2022-03-10
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Publication No.: US20230141270A1Publication Date: 2023-05-11
- Inventor: Chi Seong Kim , Won Seok Lee , Guh Hwan Lim , Jin Uk Lee , Jin Oh Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20210152892 2021.11.09
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18 ; H05K3/00
Abstract:
A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
Public/Granted literature
- US11903129B2 Printed circuit board Public/Granted day:2024-02-13
Information query
