- 专利标题： METHOD FOR MOLDING AND FORMING FLIP-FLOP AND MOLD THEREOF
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申请号： US17546749申请日： 2021-12-09
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公开(公告)号： US20230144539A1公开(公告)日： 2023-05-11
- 发明人: Ching-Hao CHEN , Liang-Hui YEH
- 申请人： OTRAJET INC.
- 申请人地址： TW Taichung City
- 专利权人： OTRAJET INC.
- 当前专利权人： OTRAJET INC.
- 当前专利权人地址： TW Taichung City
- 优先权： TW 0141653 2021.11.09
- 主分类号： B29D35/02
- IPC分类号： B29D35/02 ; B29C44/58
摘要：
A main technical feature of a method for molding and forming a flip-flop and a mold thereof provided by the invention is that when a polymer raw material is filled into a mold chamber space of the mold, the filled raw material is preferentially flowed in a direction of a strap area space used to mold a V-shaped strap portion of the flip-flop to ensure that the slender V-shaped strap portion of the flip-flop can be integrally formed.
公开/授权文献
- US11865802B2 Method for molding and forming flip-flop and mold thereof 公开/授权日：2024-01-09
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