Invention Publication
- Patent Title: FILM FOR MANUFACTURING ELECTRONIC COMPONENT
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Application No.: US17831025Application Date: 2022-06-02
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Publication No.: US20230156896A1Publication Date: 2023-05-18
- Inventor: Dae Jin SHIM , Jung Jin PARK , Su Min KIM , Jong Ho LEE , Eun Jung LEE , Jung Jin PARK
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20210157011 2021.11.15
- Main IPC: H05F1/00
- IPC: H05F1/00 ; H01G13/00

Abstract:
A film for manufacturing an electronic component includes: a polymer layer; and metal nanowires dispersed in the polymer layer. The polymer layer may include a polyester-based compound such as polyethylene terephthalate. The metal nanowire may include a ferromagnetic metal such as at least one of nickel (Ni), cobalt (Co), and iron (Fe), or alloys thereof.
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