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    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20200058446A1

    公开(公告)日：2020-02-20

    申请号：US16168576

    申请日：2018-10-23

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yeong Ju CHOE ,  Min Woo KIM ,  Eun Jung LEE ,  Ki Pyo HONG

    IPC: H01G4/30 ,  H01G4/232 ,  H01G4/005 ,  H01G4/12

    Abstract: A multilayer ceramic capacitor includes a ceramic body including an active portion that includes a dielectric layer and a plurality of internal electrodes overlapping other across the dielectric layer, and cover portions formed above and below the active portion, and including first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, and first and second side margin portions disposed on the first and second surfaces. In a cross-section of the ceramic body in a length-thickness (L-T) direction, a ratio Sd/Sc of an area Sd of a region except for the active portion to an overall area Sc of the section is greater than 27%.

    METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT
    4.
    发明公开
    METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20240112864A1

    公开(公告)日：2024-04-04

    申请号：US18219854

    申请日：2023-07-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yong PARK ,  Jung Tae PARK ,  Jong Ho LEE ,  Eun Jung LEE ,  Yong Min HONG ,  Jung Jin PARK ,  Rak Hyeon BAEK ,  Sun Mi KIM ,  Yong Ung LEE

    IPC: H01G4/30

    CPC classification number: H01G4/30

    Abstract: A method of manufacturing a multilayer electronic component includes cutting a stack, in which internal electrode patterns and ceramic green sheets are alternately stacked in a stacking direction, to obtain unit chips and attaching a portion of a ceramic green sheet for a side margin portion to the unit chips in a direction, different from the stacking direction. The attaching includes attaching the portion of the ceramic green sheet to the unit chips by compression between a first elastic body on which the ceramic green sheet is disposed and the unit chips. The first elastic body includes a first elastic layer having and a second elastic layer having an elastic modulus different from the first elastic layer, and disposed between the unit chips and the first elastic layer. An elastic modulus of the first elastic body is greater than 50 MPa and less than or equal to 1000 MPa.

    MULTILAYER CAPACITOR
    5.
    发明申请
    MULTILAYER CAPACITOR 有权

    公开(公告)号：US20220130612A1

    公开(公告)日：2022-04-28

    申请号：US17222499

    申请日：2021-04-05

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong Ho LEE ,  Chang Ho SEO ,  Eun Jung LEE ,  Myung Chan SON ,  Jung Tae PARK ,  Chang Soo PARK ,  Min Woo KIM

    IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/008

    Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked, and further including a plurality of internal electrodes having a dielectric layer interposed therebetween and external electrodes disposed on external surfaces of the body and connected to the internal electrodes. The body further includes an active portion in which the plurality of internal electrodes are located to form capacitance and a side margin portion covering a first surface and a second surface of the active portion opposing each other. An average grain size of a dielectric layer included in the active portion is different from an average grain size of a dielectric layer included in the margin portion. The side margin portion includes an extending portion extending between the external electrodes and the internal electrodes to cover a portion of the internal electrodes.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    9.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210142948A1

    公开(公告)日：2021-05-13

    申请号：US17153991

    申请日：2021-01-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sim Chung KANG ,  Eun Jung LEE ,  Ki Pyo HONG ,  Yong PARK

    IPC: H01G4/30 ,  H01G4/008 ,  H01G4/12

    Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes stacked to be alternately exposed to one side surface and the other side surface with the dielectric layer disposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body to be connected to the first and second internal electrodes, respectively, in which the ceramic body includes an area of overlap in a thickness direction of the first and second internal electrodes, margin region, and/or cover region, and the margin region in the width direction and/or the cover region includes a phosphoric acid-based second phase.

    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20200294721A1

    公开(公告)日：2020-09-17

    申请号：US16887156

    申请日：2020-05-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yeong Ju CHOE ,  Min Woo KIM ,  Eun Jung LEE ,  Ki Pyo HONG

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G4/232

    Abstract: A multilayer ceramic capacitor includes a ceramic body including an active portion that includes a dielectric layer and a plurality of internal electrodes overlapping other across the dielectric layer, and cover portions formed above and below the active portion, and including first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, and first and second side margin portions disposed on the first and second surfaces. In a cross-section of the ceramic body in a length-thickness (L-T) direction, a ratio Sd/Sc of an area Sd of a region except for the active portion to an overall area Sc of the section is greater than 27%.

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